Inorganic Functional Materials (Environmental Amenity and Electronic Materials) Inorganic ion capture agent IXEPLAS

IXEPLAS is a higher performance version of IXE, our ion-trapping agent, with superior ion-trapping and heat resistance properties. In addition to increasing the reliability of sealing materials, it can also be used for advanced semiconductor packages.

Usage
Information technology
Electronic materials Computers Mobile information terminals Others
Home electronics
Televisions and DVD Lighting equipment
Environment and energy
Recycling Reduce environmental impact Others
Basic materials
Resin and rubber additives Paint, ink, coatings and adhesives Others
Lifestyle
Printing materials Packaging materials
Function
Barrier and protection Filtration Molding and processability Adhesiveness Corrosion resistance Water resistance Heat resistance Chemical resistance Dispersibility Low corrosiveness

Features

Features

  • Its primary particle size is on the sub-micron level and it can be used for underfill materials, narrow pitch sealants, and more.
  • The fine particle size makes it highly effective in small quantities.
  • It traps copper and silver ions, making it ideal for copper bonding wire, sealing silver wiring, and more.
  • Shows ion-trapping capability at a broad pH range because it is a dual ion exchanger.
  • With minimal impurities, it has almost no negative effects on sealing materials.
  • Contains no substances subject to the Restriction of Hazardous Substances (RoHS) Directive.
Image of IXEPLAS ion-trapping

Mechanism of action

Image of IXEPLAS ion-trapping

  • IXEPLAS's fine particle size makes it effective in smaller quantities compared to IXE.
Features

Usage

  • IC sealing material (EMC, liquid sealing material, underfill material, and die bonding)
  • FPC Adhesives
  • Solar battery materials and components (back sheet, sealing resin)
  • Resist inks
  • Conductive pastes, etc.

Specifications

Suppression of copper wiring migration

  • IXEPLAS has a high capacity to trap copper ions and is effective in suppressing copper migration.
  • It is also ideal for sealing copper bonding wires and copper wiring.
  • It can also be used to suppress the migration of silver wiring.
Copper wiring migration test
Copper wiring migration test
Test conditions
  • Epoxy acrylate + urethane acrylate resin 98 parts, IXEPLAS-A1 1.0 part
  • Wiring width 50 μm wiring spacing 50 μm
  • Moisture resistance load test (85℃, 85% RH, 50V, 500 hours, 1000 hours)
Related products
Inquiries
Inorganic Functional Materials Department

*9:00 am - 5:00 pm (except weekends and holidays)