Inorganic Functional Materials (Environmental Amenity and Electronic Materials) Inorganic ion capture agent IXEPLAS
IXEPLAS is a higher performance version of IXE, our ion-trapping agent, with superior ion-trapping and heat resistance properties. In addition to increasing the reliability of sealing materials, it can also be used for advanced semiconductor packages.
Usage
- Information technology
- Electronic materials Computers Mobile information terminals Others
- Home electronics
- Televisions and DVD Lighting equipment
- Environment and energy
- Recycling Reduce environmental impact Others
- Basic materials
- Resin and rubber additives Paint, ink, coatings and adhesives Others
- Lifestyle
- Printing materials Packaging materials
Function
Barrier and protection
Filtration
Molding and processability
Adhesiveness
Corrosion resistance
Water resistance
Heat resistance
Chemical resistance
Dispersibility
Low corrosiveness
Features
Features
- Its primary particle size is on the sub-micron level and it can be used for underfill materials, narrow pitch sealants, and more.
- The fine particle size makes it highly effective in small quantities.
- It traps copper and silver ions, making it ideal for copper bonding wire, sealing silver wiring, and more.
- Shows ion-trapping capability at a broad pH range because it is a dual ion exchanger.
- With minimal impurities, it has almost no negative effects on sealing materials.
- Contains no substances subject to the Restriction of Hazardous Substances (RoHS) Directive.
Mechanism of action
Image of IXEPLAS ion-trapping
- IXEPLAS's fine particle size makes it effective in smaller quantities compared to IXE.
Usage
- IC sealing material (EMC, liquid sealing material, underfill material, and die bonding)
- FPC Adhesives
- Solar battery materials and components (back sheet, sealing resin)
- Resist inks
- Conductive pastes, etc.
Specifications
Suppression of copper wiring migration
- IXEPLAS has a high capacity to trap copper ions and is effective in suppressing copper migration.
- It is also ideal for sealing copper bonding wires and copper wiring.
- It can also be used to suppress the migration of silver wiring.
Copper wiring migration test
Test conditions
- Epoxy acrylate + urethane acrylate resin 98 parts, IXEPLAS-A1 1.0 part
- Wiring width 50 μm wiring spacing 50 μm
- Moisture resistance load test (85℃, 85% RH, 50V, 500 hours, 1000 hours)
Related products
Inquiries
Inorganic Functional Materials Department
*9:00 am - 5:00 pm (except weekends and holidays)
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