Film adhesives

We offer adhesives in film form. They ensure a uniform thickness of the adhesive layer, eliminate the application or drying process on site, as well as simplify the production of various composite films through laminate processing.

Product Name: ARON MELT

Features
Usage
Specifications

Features

Features of hot melt adhesive films

ARON MELT PES Series

ARON MELT PES is a series of thermoplastic polyester adhesives. The series offers superior adhesion to resins such as PET, PC, and PVC as well as metals such as copper and aluminum. Due to their excellent solvent resistance and electrical characteristics, these products can be used in laminate adhesives for FFC and IC cards, as well as in sealant materials.

Excellent adhesion to resins and metals, including PET, PC, ABS and PVC.
Excellent electrical characteristics including voltage resistance and high insulation characteristics.
The crystalline type of this line exhibits outstanding solvent resistance.

ARON MELT PPET Series (Developed products)

ARON MELT PPET-1200 is a series of heat resistant, hot melt adhesives developed for the lamination and bonding of different materials, such as metal with plastic. Products are available as pellets and films.

Excellent adhesion to plastics including, PP, PE and PET, as well as metals such as aluminum and copper.
Features low hygroscopicity and excellent chemical resistance to acids, alkalis and alcohols.
As a hot melt adhesive, it can achieve adhesion within a short time.
Improves work environment as it uses zero organic solvent.

Features of highly heat-resistant adhesive film (developed product)

Demonstrates high adhesive strength in the high temperature range (60°C to 120°C)
High adhesion to low polarity materials such as polyolefin
High transparency
Excellent adhesion to curved surfaces

Features of light curable adhesive film (Developmental Product)

High heat resistance and durability
High peel strength, and less susceptible to bubbles and peeling in environmental tests
Good unevenness following property
Flexible before light curing, excellent unevenness following property
Good optical properties
Uses low coloration and high transparency acrylic resin
Acid-free design
Contains no acidic components and is resistant to metal corrosion

Features of low dielectric bonding film (developed product)

Film type modified epoxy adhesive
Excellent dielectric properties (Dk = 2.2, Df = 0.002)
Excellent adhesion to substrates such as polyimide, LCP, and copper foil
Excellent solder dip resistance

Usage

Hot melt adhesive film PES Series

Excellent adhesion to resins such as PET, polycarbonate and vinyl chloride, and metals such as copper and aluminum. Can be used in laminate adhesives for FFC and IC cards, as well as in sealant materials.

Hot melt adhesive film PPET Series

Excellent adhesion to plastics such as PP, PE and PET and metals such as copper and aluminum. Can be applied to laminating and bonding different types of material.

Highly heat-resistant adhesive film

Good adhesion to plastics such as acrylic and polycarbonate, low-polarity materials such as PP, COP, and fluoropolymers, and glass. Maintains high adhesive strength even at high temperatures (up to 120°C). Can also be applied to surface materials.

Light curable adhesive film

Glass, acrylic, polycarbonate, etc. Flexible before curing and excellent in unevenness following property. Since it does not contain acidic components, it is resistant to metal corrosion.

light curable adhesive film

Exhibits excellent adhesiveness to substrates such as polyimide, LCP (liquid crystal polymer), and copper foil. It has excellent dielectric properties and can suppress signal loss in large volume high-speed communication.