Inorganic ion capture agent IXEPLAS

IXEPLAS is a higher performance version of IXE, our ion-trapping agent, with superior ion-trapping and heat resistance properties. In addition to increasing the reliability of sealing materials, it can also be used for advanced semiconductor packages.

Product Name: IXEPLAS

Features
Usage
Specifications

Features

Its primary particle size is on the sub-micron level and it can be used for underfill materials, narrow pitch sealants, and more.
The fine particle size makes it highly effective in small quantities.
It traps copper and silver ions, making it ideal for copper bonding wire, sealing silver wiring, and more.
Shows ion-trapping capability at a broad pH range because it is a dual ion exchanger.
With minimal impurities, it has almost no negative effects on sealing materials.
Contains no substances subject to the Restriction of Hazardous Substances (RoHS) Directive.

Mechanism of action

Image of IXEPLAS ion-trapping

IXEPLAS's fine particle size makes it effective in smaller quantities compared to IXE.

Usage

IC sealing material (EMC, liquid sealing material, underfill material, and die bonding)
FPC Adhesives
Solar battery materials and components (back sheet, sealing resin)
Resist inks
Conductive pastes, etc.

Specifications

General Characteristics

Grade List (Japanese only) [PDF:16KB]

Ion scavenging effect

IXEPLAS is added to IC encapsulants to trap ionic impurities contained in the encapsulant.
IXEPLAS emits very few impurity ions.

Pressure cooker test for epoxy resin

Test conditions

Bisphenol epoxy resin + amine curing agent 100 parts, Ion scavenger 2.0 parts
Pressure cooker test: 1.0 g of crushed resin / 20 ml of ion-exchanged water, 121°C x 20 hours

Applications

Suppression of copper wiring migration

IXEPLAS has a high capacity to trap copper ions and is effective in suppressing copper migration.
It is also ideal for sealing copper bonding wires and copper wiring.
It can also be used to suppress the migration of silver wiring.

Copper wiring migration test

Test conditions

Epoxy acrylate + urethane acrylate resin 98 parts, IXEPLAS-A1 1.0 part
Wiring width 50 μm wiring spacing 50 μm
Moisture resistance load test (85℃, 85% RH, 50V, 500 hours, 1000 hours)

Corrosion inhibition of aluminum wiring

The addition of IXEPLAS to the encapsulating resin suppresses the corrosion of wiring and improves reliability.
Because of its fine particle size, a small amount of the product can be effective.

Rate of increase in resistance of aluminum wiring

In semiconductor packages, free Cl- ions in the sealing resin cause corrosion. This causes the resistance of the wiring to increase.

The addition of IXEPLAS traps Cl- ions in the sealing resin, suppressing corrosion and almost eliminating any increase in resistance.

Test conditions

Adding IXEPLAS to bisphenol epoxy resin, applying and curing to aluminum wiring (wiring width: 20 µm, spacing between wires: 20 µm)
Pressure cooker test at 130°C, 85%RH, 20V and observe the condition of aluminum wiring after the test (20hr).